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Test & Measurement

Solutions for optical quality control

Test & Measurement refers to all industrial applications in which microscopic structures have to be displayed and analysed. 

Here are some examples where the imaging modules are used:

- Semiconductor technology, SMD inspection, solder joint analysis

- Automotive, quality control, process control, cylinder inspection

- Metallography (hardness testing, crimp analysis, weld seam control) 

- Energy, solar wafer inspection

-.................

Metallurgical Sample Analysis with Opto's Machine Vision Microscopes

Metallurgical Sample Analysis

Customer-Task:

  • Grain & Structure Analysis of Metals
  • Predictive Maintenance of production processes
  • Quality control of mechnanical parts
  • Damage evaluation of metal malfunction

Solution:

  • Imaging Module compact M (MVM) with integrated ring- and coaxial illumination
  • Small footprint with portable stand and case
  • Easy to use and free OptoViewer 2.0 software
  • Direct measurement without calibration

Advantages for the customer:

  • Pure all in one digital microscope
  • Micrometer / pixel Resolution with large FoV
  • High Contrast and Color stability
  • Repeatability of Image


Application note (one page)        

Application note (four pages) 

Wafer and PCB inspection with Imaging Modules

Tasks

- Optical defect analysis, quality control and documentation of ICs, FPGAs, BGAs

- one-sided, two-sided or multilayer PCB inspection

- Detection of cracks, short circuits, defective electrical connections or bridges

- optical post-bond / post-reflow inspection with pin counting and component identification

- Detection of irregularities in wafer coatings

- Analysis of impurities, cracks or identification of particles and scratches


Solution

- IM-compact M or IM-linea XL in monochrome or colour version

 - application-optimised optoelectronics available in USB 3.1 or GigE - Plug&Play

- easy-to-use and free OptoViewer 2.0 software

- various SDK and toolkits as well as BV plug-ins for machine integration


Added value

- All-in-one digital microscope optimised for mobile use

- More compact than conventional microscopes 

- reliable image data with highest image quality and good colour fidelity

- good price-performance ratio with software support


Application note (one page)         

Application note (four pages) 



Wafer screening with a digital microscope compact M

A compact M digital microscope from the Imaging Module family is ideal for analysing reflective wafer surfaces and displaying the smallest structures. 

The following features are unique to a single vision sensor:

  • Integrated coaxial brightfield illumination
  • Compact and robust design 
  • Quick change between different modules
  • Apochromatic corrected microscope optics with long working distance
  • 5MP IMX Sony image sensor
  • Open software architecture with own SDK

In the picture on the right you can see two IM from the IC10-05 series (copy number and find the corresponding data sheet in the Productfinder)

Weldinspection

The Analysis of welding results is a typical challenge of Metallography labs.

The Machine Vision Microscope with Coaxial Light and with Ring Light is perfect for Micro weld inspection.

One Plug and play Digital Microscope. No change of Equipment.

- Magnification: 3,75x,

- FoV: 2,2x1,8mmWD 36mm

- 5MP Sony IMX264 monochrome

- USB 3.1, 0.9 µm/Pixel

With the free OptoViewer it is also possible to execute pre calibrated measurements easily.

Hardness Testing (Vickers & Brinell)

Hardness Testing

Micro Hardness Testing needs high end optical microscopy images.
Opto is delivering since years Imaging Modules in existing Machinery.


solino can principally disrupt this business because:

- with solino we can detect micro indents on a big surface, by analyzing the reflections

- It is possible to identify the position of a μm size Indent, on big area with a standard camera

- solino analyses anomalies and offers reliable info about an indent of the object surface

- This makes the vision setup independent from the object surface or ambient light conditions

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